在质子膜从厚膜向薄膜、比如50微米乃至更薄演进的过程中，主要面临两大核心挑战。第一是膜电极内部三相界面，即电子、质子、水汽的精细管理与热质传递难题。薄膜意味着更高的电流密度和效率，同时也会导致水流量和产热量急剧增大。这就要求多孔层与流道的设计必须极为高效，能够及时将多余的热量带走，并确保水、气顺畅通过而不发生阻塞或气泡积聚。
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To achieve testability in modular software we need to leverage the Dependency Inversion Principle (DIP) up to the level of application architecture. That was the reasoning behind introducing the concept of Infrastructure-Modules. When we extract all the infrastructure code from Business-Modules, they can stay focused on the business logic and have no design/compile-time dependencies on any untestable infrastructure code. As a side effect, we achieve Separation of Concerns.